[MLUG - DISCUSSION] I.B.M. Advance Connects Layers of Tiny Wafers

[Mike Miller <EMAIL:PROTECTED>]

FYI...

I.B.M. Advance Connects Layers of Tiny Wafers
from The New York Times

SAN FRANCISCO, Nov. 10 - Researchers plan to announce on Monday a new
approach to building three-dimensional integrated circuits, a technique
that may one day be essential in creating faster microprocessors and
higher-capacity memory chips.

The company plans to detail its results in a technical paper to be
presented at the annual International Electron Device Meeting here next
month.

The advance involves transferring a remarkably thin slice of a circuit
onto a glass substrate and transferring it again onto another wafer that
contains the bottom half of the circuit. The slice is created by using
advanced mechanical grinding and etching processes.

One advantage of the technique would be to interconnect separate layers
directly at thousands or even hundreds of thousands of points. Computer
speeds are currently limited by the bottleneck of getting data on and off
individual chips. Increasing the number of connections may sharply
increase communication speeds.

Full text:

<http://www.nytimes.com/2002/11/11/technology/11CHIP.html>

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